Although a high level of uncertainty still looms over the global economy, sales of smartphones continue to reach new highs and the Internet of Things looms on the horizon. IC Insights will present its forecast for the IC market and unit volume shipments in the context of the IC industry cycle model. In order to make sense out of the current turmoil, a top-down analysis of the IC market will be given and include trends in worldwide GDP growth, electronic system sales, and semiconductor industry capital spending and capacity.
Wafer level fan-out technology has grown from a niche solution as a single die package with a limited supply chain into a hyper-growth technology delivering the industry’s highest interconnect density . With Moore’s Law slowing due to economic challenges, SoC designers are partitioning monolithic silicon devices into multi-chip architectures that require tight die-to-die spacing and ultra-high density interconnect. Fan-out technology is now emerging as a key enabler of these future devices built from disparate blocks of silicon. However, cost, capability, yield and scale must all come together to enable mass market adoption.
Tim's presentation explored how fan-out technology is fueling an industry transition including:
- Convergence of capabilities from foundries to SATS to EMS
o Interconnect density
o Capital intensity
- Key capabilities required to enable large area formats and significant scale