Thanks to everyone who attended the IMAPS Device Packaging Conference in March. We had excellent attendance and a sold-out exhibit hall. We hope to see any new IMAPS members in the area at our next AZ luncheon on April 24th.
The Arizona Chapter serves the IMAPS members residing in Arizona and New Mexico. The IMAPS Arizona Chapter promotes and cultivates a local forum for the exchange of technical information and industry solutions relating to microelectronics to help our members and their companies better compete in today’s global economy. The chapter holds technical meetings, plant tours, and networking social events throughout the year.
Cost effectiveness, flexibility and continuous transformation are the predominant factors keeping the wire bonding key interconnect process in semiconductor packaging. Wire bonding eco system has been continuously transforming in recent times. Industry started to move from Au wire to Cu wire in the past 5 years; now migration to Ag wire is being actively pursued. The whole eco system from wafer fab, probe, wire, capillary, wire bonding equipment, molding to packaging materials are trying to adapt to this new evolution. Copper wire bonding is already in high volume production, now proliferation is entering into next phase of Cu wire bonding implementation on various challenging applications. Presentation shall focus on the knowledge frame work and process characterization methodologies for the next phase of Cu and Ag wire bonding proliferation.