Thank you for joining the AZ Chapter for our most recent Luncheon Presentation on April 16th, 2015

John Hunt of ASE presented "Innovation in Fan Out Packaging for Mobile Applications".

Download a copy of John's presentation here!

Mobile electronics has created the need for ever increasing density and performance in electronics packaging.  This evolution has led to a need for higher levels of component density and functionality than has been traditionally available using standard packaging.  The packaging industry has responded with a plethora of packaging options, each tailored for a specific set of customer requirements.

We will review how the integration of a wide variety of wafer level processing technologies, substrate evolution and Flip Chip packaging structures have come together into packages for Mobile applications with higher levels of integration and sophistication than has ever been possible in the past.  These options include Wafer Level Fanout, Panel Level Fanout with embedded die, and Chip Last Fanout packaging combining low cost materials and process flows. Using these tools and processes, the resulting packaging combinations will only be limited by our imaginations, and our creativity in innovating them.

IMAPS AZ Chapter

The Arizona Chapter serves the IMAPS members residing in Arizona and New Mexico. The IMAPS Arizona Chapter promotes and cultivates a local forum for the exchange of technical information and industry solutions relating to microelectronics to help our members and their companies better compete in today’s global economy. The chapter holds technical meetings, plant tours, and networking social events throughout the year.

Presentation Summary - IC Market Outlook in an Unstable Economy

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Bill presented IC Insights’ forecast that 2015 will continue the integrated circuit industry cyclical upturn that began in 2013.  This cyclical upturn is expected to gain momentum over the next several years, resulting in a 6.4% IC market CAGR over the 2013-2018 time period, which would be more than 3x the 1.7% CAGR the IC market displayed from 2007-2012.  Moreover, IC unit volume shipments (which drive packing capacity) are forecast to register a 2013-2018 CAGR of 7.1%, much better than the 4.0% CAGR shown in the 2007-2012 time period.

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Luncheon Presentations

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The IMAPS AZ Chapter strives to bring interesting speakers and topics to our community. If you, or someone you know, would like to make a presentation at one of our Chapter luncheons, please contact us.

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