Mobile electronics has created the need for ever increasing density and performance in electronics packaging. This evolution has led to a need for higher levels of component density and functionality than has been traditionally available using standard packaging. The packaging industry has responded with a plethora of packaging options, each tailored for a specific set of customer requirements.
We will review how the integration of a wide variety of wafer level processing technologies, substrate evolution and Flip Chip packaging structures have come together into packages for Mobile applications with higher levels of integration and sophistication than has ever been possible in the past. These options include Wafer Level Fanout, Panel Level Fanout with embedded die, and Chip Last Fanout packaging combining low cost materials and process flows. Using these tools and processes, the resulting packaging combinations will only be limited by our imaginations, and our creativity in innovating them.