Please join the AZ Chapter for our next Luncheon Presentation on February 16th, 2017

Bill McClean of IC Insights will present "IC Market Update and China Impact Analysis”

A high level of uncertainty still looms over the global economy, sales of smartphones are beginning to saturate, and the Internet of Things looms on the horizon.  In order to make sense out of the current turmoil, a top-down analysis of the IC market will be given and include trends in worldwide GDP growth, electronic system sales, and semiconductor industry capital spending and capacity.  A critical look at China's ambitions to become a bigger player in the IC industry will also be presented.

Thank you for joining the AZ Chapter for our most recent Luncheon Presentation on December 8th, 2016

Jeb Flemming of 3D Glass Solutions presented "Photosensitive Glass-Ceramics for the Electronics Packaging Industry"

Download a copy of Jeb's presentation here!

Photosensitive glass-ceramic (PSG) materials offer a number of advantages over traditional packaging materials, such as laminates, ceramics, and other glassy materials, including: (1) better RF material properties, (2) decreased surface roughness for fine line redistributions, (3) the ability to create small, precise, features with at higher densities, and (4) the opportunity to integrate passive devices (IPDs) such as High-Q inductors and capacitors into the interposer substrate itself along with other active and passive devices.

PSGs offer a unique material set to build highly integrated Glass-based System-in-package and System-on-Chip devices for the RF, IoT, and Sensor industries.  PSGs enable a batch manufacturing method to create a variety of 3D structures in glass, including:  through glass vias, cavities, fiber optic trenches, and other highly precise 3D structures in glass. 

Jeb's presentation included an overview of PSGs for the electronics packaging industry with a focus on the integration of integrated passive devices (IPDs) for the RF industry and 3D Glass Solutions' recent advances in the monolithic production of high Q inductors and capacitors supported by modeling and measurement data.

IMAPS AZ Chapter

The Arizona Chapter serves the IMAPS members residing in Arizona and New Mexico. The IMAPS Arizona Chapter promotes and cultivates a local forum for the exchange of technical information and industry solutions relating to microelectronics to help our members and their companies better compete in today’s global economy. The chapter holds technical meetings, plant tours, and networking social events throughout the year.

Presentation Summary - IC Market Outlook in an Unstable Economy

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Bill presented IC Insights’ forecast that 2015 will continue the integrated circuit industry cyclical upturn that began in 2013.  This cyclical upturn is expected to gain momentum over the next several years, resulting in a 6.4% IC market CAGR over the 2013-2018 time period, which would be more than 3x the 1.7% CAGR the IC market displayed from 2007-2012.  Moreover, IC unit volume shipments (which drive packing capacity) are forecast to register a 2013-2018 CAGR of 7.1%, much better than the 4.0% CAGR shown in the 2007-2012 time period.

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Luncheon Presentations

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The IMAPS AZ Chapter strives to bring interesting speakers and topics to our community. If you, or someone you know, would like to make a presentation at one of our Chapter luncheons, please contact us.

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