A high level of uncertainty still looms over the global economy, sales of smartphones are beginning to saturate, and the Internet of Things looms on the horizon. In order to make sense out of the current turmoil, a top-down analysis of the IC market will be given and include trends in worldwide GDP growth, electronic system sales, and semiconductor industry capital spending and capacity. A critical look at China's ambitions to become a bigger player in the IC industry will also be presented.
Photosensitive glass-ceramic (PSG) materials offer a number of advantages over traditional packaging materials, such as laminates, ceramics, and other glassy materials, including: (1) better RF material properties, (2) decreased surface roughness for fine line redistributions, (3) the ability to create small, precise, features with at higher densities, and (4) the opportunity to integrate passive devices (IPDs) such as High-Q inductors and capacitors into the interposer substrate itself along with other active and passive devices.
PSGs offer a unique material set to build highly integrated Glass-based System-in-package and System-on-Chip devices for the RF, IoT, and Sensor industries. PSGs enable a batch manufacturing method to create a variety of 3D structures in glass, including: through glass vias, cavities, fiber optic trenches, and other highly precise 3D structures in glass.
Jeb's presentation included an overview of PSGs for the electronics packaging industry with a focus on the integration of integrated passive devices (IPDs) for the RF industry and 3D Glass Solutions' recent advances in the monolithic production of high Q inductors and capacitors supported by modeling and measurement data.