Date Company Presenter Presentation Title Download
Feb 16, 2017 IC Insights Bill McClean
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Dec. 8, 2016 3D Glass Solutions Jeb Flemming

APEX® Glass RF IPDs For Applicatons up to 40 GHz

 PDF icon
Sept. 29, 2016 StatsChipPac  Nokibul Islam

Low Cost Fine Pitch Cu Pillar Assembly Challenges for Consumer Flip Chip Package

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May 19, 2016  StatsChipPac Vinayak Pandey Molded Interconnect System (MIS) Packaging Technology  PDF icon
April 21, 2016  Intel  Ravi Mahajan Localized High Density Interconnects with Intel’s EMIB  PDF icon
Feb. 18, 2016  IC Insights Bill McClean 


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Jan. 14, 2016 Deca Technologies Tim Olson

Enabling a New Class:  The Panel Level SoC

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April 16, 2015 ASE John Hunt

Innovations in Fan Out Packaging for Mobile Applications

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Feb 18, 2015 IC Insights  Bill McClean IC Market Outlook in an Unstable Economy pdf icon
 Dec 4, 2014  Synaptics  Brett Dunlap Challenges of Fingerprint Sensor and Package Integration  N/A
 Nov 13, 2014  Qualcomm  Ahmer Syed

Mechanical, Thermal, and reliability Challenges in Packaging for Mobile


 Sept 11, 2014 IC Insights   Bill McClean  Major Trends Shaping the Future IC Industry  pdf icon
 April 24, 2014  ASM Pacific  Leroy Christie  Transforming the Wire Bond ECO System  pdf icon
 Feb 26, 2014  APSTL  Dev Gupta  Package Level Integration - Roadmap Based on Performance Modeling  N/A
 Nov 14, 2013  Gartner  Jim Walker  Supply Chain Implications for Advanced Packaging  pdf icon
Feb 21, 2013 IC Insights Bill McClean  The “New” IC Industry Cycle Model  N/A
Jan 24, 2013  Amkor/Intel

 Curtis Zwenger

Hamid Azimi

The Future of Packaging 

Dr. Hamid R. Azimi, Intel Corporation

Curtis Zwenger, Amkor Technology

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 Sept 6, 2012  Intel  Celeste Fralick  The Consumerization of Biotech:  Impact to the Semiconductor Ecosystem  N/A
May 3, 2012  Kyocera  Nobuyuki Fukabori Ceramic Packages for LED N/A
 Feb 16, 2012  IC Insights Bill McClean 

Why IC Market Growth Will Be Much

Better Over the Next 10 Years

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Dec 15, 2011 Intel Jinlin Wang Surface Energy and Wettability Study of Flip Chip Packaging Materials pdf icon
Oct 27, 2011 Amkor Ron Huemoeller

Challenges & Opportunities for 3DIC TSV Based Products

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